Silicon Semiconductor Technology

The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit.

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It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.

SKU: 9783658410407
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Weight 1 kg
Dimensions 24 × 17 × 2 cm
Book Author

Ulrich Hilleringmann

Edition

1st

Format

Paperback

ISBN

9783658410407

Language

English

Pages

264

Publication Year

Publisher

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