System-in-Package RF Design and Applications

By (author)Michael Gaynor

In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost.

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SKU: 9781580539050
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Dimensions 24 × 17 × 2 cm
Book Author

Michael Gaynor

Edition

1st

Format

Hardback

ISBN

9781580539050

Language

English

Pages

240

Publication Year

Publisher

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